PCB
FPC
Rigid-Flex
FR-4
HDI PCB
Rogers High-Frequency Board
PTFE Teflon High-Frequency Board
Aluminum
Copper Core
PCB Assembly
LED light PCBA
Memory PCBA
Power Supply PCBA
New Energey PCBA
Communication PCBA
Industrial Control PCBA
Medical Equipment PCBA
Testing Service
PCBA Testing Service
Certification Application
RoHS Certification Application
REACH Certification Application
CE Certification Application
FCC Certification Application
CQC Certification Application
UL Certification Application
Transformers, Inductors
High Frequency Transformers
Low Frequency Transformers
High Power Transformers
Conversion Transformers
Sealed Transformers
Ring Transformers
Inductors
Wires,Cables Customized
Network Cables
Power Cords
Antenna Cables
Coaxial Cables
Net Position Indicator
Solar AIS net position indicator
Capacitors
Connectors
Diodes
Embedded Processors & Controllers
Digital Signal Processors (DSP/DSC)
Microcontrollers (MCU/MPU/SOC)
Programmable Logic Device(CPLD/FPGA)
Communication Modules/IoT
Resistors
Through Hole Resistors
Resistor Networks, Arrays
Potentiometers,Variable Resistors
Aluminum Case,Porcelain Tube Resistance
Current Sense Resistors,Shunt Resistors
Switches
Transistors
Power Modules
Isolated Power Modules
AC-DC Power Modules
DC-AC Module(Inverter)
RF and WirelessSelection Guide for 150°C-Resistant SMT Adhesives in High-Temperature Applications
2025-07-01
1. Failure Mechanisms & Requirements
| Failure Mode | Trigger Condition | Material Requirement |
|---|---|---|
| Adhesive cracking | Thermal cycling (-40~150℃) | CTE≤60ppm/°C |
| Strength degradation | 150℃×1000h aging | Strength retention ≥80% |
| Yellowing/carbonization | Oxidation @150℃ | OIT >30min |
| Conductive adhesive migration | E-field + heat | Volume resistivity >10¹²Ω·cm |
2. Adhesive System Comparison
| Type | Example Product | Temp Resistance | Pros/Cons |
|---|---|---|---|
| Modified Epoxy | Henkel Loctite ABLESTIK 3630 | 180℃ long-term | High strength (>25MPa), brittle |
| SilICone | Dow Corning SE 4480 | 200℃ long-term | Flexible (elongation>150%), needs primer |
| Polyimide (PI) | Duplex 892 | 300℃ short-term | Radiation-resistant, high cure temp |
| Cyanate Ester | Lonza CYCOM 5575 | 180℃ long-term | Low Df (<0.005), expensive |
3. Key PeRFormance Criteria
| Parameter | Test Standard | 150℃ Requirement |
|---|---|---|
| Glass Transition (Tg) | ASTM D7028 | Tg≥170℃ (20℃ above operating) |
| TGA Weight Loss | ASTM E1131 | <0.5% loss @150℃ (1000h) |
| Shear Strength | ISO 4587 | Initial >15MPa, aged >12MPa |
| Volume Resistivity | IEC 60093 | >10¹²Ω·cm @150℃ |
4. Filler System Design
4.1 Functional Fillers
| Filler Type | Loading | Function |
|---|---|---|
| Nano Al₂O₃ (40nm) | 20~30wt% | Thermal cond. ↑ (0.8→1.5W/mK) |
| Glass Microspheres (Ø10μm) | 5~10wt% | CTE ↓ (80→50ppm/°C) |
| SiC Whiskers | 3~5wt% | Crack resistance ↑40% |
| Antioxidant (Irganox 1010) | 0.5wt% | OIT ×2 extension |
4.2 Prohibited Materials
-
✖️ Standard silver flakes (migration risk @150℃)
-
✖️ CaCO₃ fillers (decomposes CO₂ @150℃)
5. Process Compatibility
| Process Step | Challenge | Solution |
|---|---|---|
| Dispensing | Viscosity instability | Thixotropic index >4.5 |
| Curing | Substrate warpage | Step cure: 120°C×30min→150°C×60min |
| Rework | Component damage | Decomposition temp >250℃ |
6. Application-Specific Solutions
| Application | Recommended Adhesive | Special Requirement |
|---|---|---|
| Automotive ECU | Conductive Ag (80%) | Fuel vapor resistance |
| LED Headlights | High-reflective silicone | UV stability |
| Oil Drilling Sensors | Ceramic-filled epoxy | H₂S corrosion resistance |
| Aerospace Electronics | Polyimide adhesive | NASA low-outgassing certified |
7. Validation Testing
| Test | Condition | Pass Criteria |
|---|---|---|
| High-Temp Shear | 10MPa load @150℃ | No failure @1000h |
| Thermal Cycling | -40℃↔150℃, 1000 cycles | Strength loss <20% |
| THB Aging | 85℃/85%RH, 1000h | Volume resistivity >10¹⁰Ω·cm |
| Thermal Shock | 150℃(5min)←→LN₂(1min) | No delamination/cracks |