Mixed assembly

Mixed assembly

What is a hybrid assembly?
Although suRFace mount technology has become the main installation method inPCBmanufacturing, there are still some components that are not suitable for Smt Assembly. Then, SMT assembly and THT assembly need to be applied on the same board. This combination of assembly techniques is called hybrid assembly, which does not use solder paste during the manufacturing process.

Most components are soldered onto the board in a surface-mount configuration, but for certain components that are not available in the SMT process, hybrid PCB assembly is required.

Comparison between SMT assembly and THT assembly
First, SMT components are soldered onto the board using a reflow machine, which is fully automated. THT assembly requires pre-drilling holes on the board and using wires to connect components and circuits. Both wave soldering and manual soldering are standard methods in the THT assembly process.

Secondly, PCBs with surface-mount devices (SMD) can be reflowed or wave soldered, but PCBs with through-hole components can only be wave soldered. Therefore, if both SMT components and THT components are used on the board, the assembly process will involve more steps. Generally, the SMT process is first performed, followed by THT assembly.

Thirdly, advanced and sophisticated machines enable SMT assembly to be achieved with high precision and speed. These small and thin components can be precisely placed on the board, making SMT more suitable for high-density and small-sized PCB applications. For larger components with high reliability requirements, THT is the preferred choice as it provides a more robust connection than SMT components.

In summary, SMT assembly has the characteristics of high productivity, high precision, portability, and low cost. SMT is more economical and faster in mass production. THT components typically have high reliability, high stress tolerance, heavy weight, and high price. THT is the preferred assembly method for small PCB and prototype manufacturing.

Application of hybrid assembly
Hybrid assembly is typically used for applications that require a combination of through-hole components and SMT components. You can find hybrid technology in the following applications:

●CPU

●Smartphone accessories

● Communication hardware

●Server motherboard

●LED lighting products

●Video processing

●Industrial controller components

Minintel can provide customized components according to specific customer requirements. We specialize in providing PCB prototypes and bulk assembly. Our turnkey services include PCB manufacturing, component procurement, PCB assembly prototyping, and PCB testing. At Minintel, a variety of first-class equipment and strict quality control system help us provide you with high-quality products!