FR-4 PCB Capabilities

FR-4 PCB Capabilities

NO.

Item

Manufacturing Capabilities

1

Material

FR-4

2

Number of Layers

1 Layer / 2 Layers / 4 Layers / 6 Layer / 8 Layers / 10 Layers / 12 Layers

3

TG Grade

TG130-140 / TG150-160 / TG170-180

4

Max PCB Size

1-2 layers: 1200*300mm / 600*500mm

Multi-layers: 600*500mm

5

Min PCB Size

5mm*5mm

6

Board Size Tolerance(Outline)

±0.2mm(Milling)

±0.5mm(V-CUT)

7

SuRFace Finish

HASL with lead / HASL lead free / Immersion gold

OSP / Hard gold / ENEPIG / Immersion silver / None

8

Board ThICkness

1 Layer/2 Layers: 0.2-2.4mm

4 Layers: 0.4-2.4mm

6 Layers: 0.8-2.4mm

8 Layers: 1.0-2.4mm

10 Layers: 1.2-2.4mm

9

Board Thickness Tolerance

Thickness≥1.0mm: ±10%

Thickness<1.0mm: ±0.1mm

10

Outer Layer Copper Thickness

1oz/2oz/3oz

11

Inner Layer Copper Thickness

1oz/1.5oz

12

Soldermask

Green / Red / Yellow / White / Black / Blue / Purple / None

13

Soldermask Thickness

20-30um

14

Soldermask Bridge

Green: ≥0.1mm

Others: ≥0.15mm

15

Soldermask to soldering pad distance

≥0.05mm

16

SilkSCReen

White / Black / Yellow / None

17

Minimum Character Width

≥0.15mm

18

Minimum Character Height

≥0.75mm

19

Silkscreen to Soldermask Distance

≥0.1mm

20

V-cut Line

≥75mm

21

V-cut Line Distance

≥3.5mm

22

Outer layer Min track/spacing

≥0.0762mm

23

Inner layer Min track/spacing

≥0.1mm

24

Annual ring size

≥0.13mm

25

Grid Line track/spacing

≥0.2mm

26

Coil board Line track/spacing

≥0.2mm

27

BGA pad size

≥0.2mm

28

BGA Distance

≥0.12mm

29

Board Outlines

Track to Outline: ≥0.3mm

Trace to V-cut line: ≥0.4mm

30

Finished Hole Size Tolerance

±0.08mm

31

Finished Hole Diameter(CNC)

0.2mm-6.3mm

32

TH Via Distance

Equipotential: 0.15mm

Isoelectric: 0.25mm

33

Plated Slot Size

≥0.5mm

34

Castellated Holes

≥0.6mm

35

Non-Plated Holes

≥0.8mm

36

NPTH to Copper Line

≥0.2mm

37

Distance betwen Board to Board

≥0.8mm

38

Stamp-hole Width

≥2.0mm

39

Tab-route Width

≥1.6mm

40

Edge Rail

≥3.5mm

41

Gold Finger

Bevelling Angle: 30-45°

Depth: ≥1mm

Length: 45mm-280mm

42

Special Specification

Impedance control

Custom Layer Stackup

Interstitial Via Hole(IVH)

Via in pad

Via filled with resin

Countersinks / Counterbores

Carbon Mask

Halogen-Free

Z-axis milling

Edge Plating