TSMC's German Factory to Break Ground at the End of the Year, with Mass Production Starting by the End of 2027

[TSMC's German Factory to Break Ground at the End of the Year, with Mass Production Starting by the End of 2027]

According to a report by the "Sci-Tech Innovation Board Daily" on the 25th, a semIConductor equipment company revealed that over the past year, TSMC has been progressively confirming the list of partners for construction, factory engineering, and equipment supply chain collaboration for its 12-inch factory in Dresden, Germany. The German factory will primarily focus on 28/22~16/12 nanometer processes, targeting the automotive and industrial markets. Construction is set to commence in the fourth quarter of 2024, with equipment installation expected to begin in the third quarter of 2026. A mini production line with a monthly capacity of 3,000 wafers is planned to be established in the first quarter of 2027, with mass production potentially starting in the fourth quarter of 2027. The factory aims to gradually achieve a monthly production capacity of 40,000 wafers by 2028.