TSMC is exploring new chip packaging technology, and advanced packaging may shine brightly.

TSMC is exploring new chip packaging technology, and advanced packaging may shine brightly.

According to media reports, in order to meet the coMPUting demand of artificial intelligence (AI) in the future, TSMC is studying a new advanced chip packaging method that uses rectangular substrates instead of traditional circular wafers, allowing more chips to be placed on each wafer. Multiple informed sources indicate that TSMC is collaborating with equipment and material suppliers to develop this new approach, although commercialization may take several years.

As AI computing accelerates, leading international companies are driving continuous iteration of advanced packaging technology. Hua Fu Securities states that in the post-Moore era, advanced packaging will shine brightly. According to Yole's forecast, the advanced packaging market will grow at a compound annual growth rate of 10.6% from 2022 to 2028, reaching US$78.6 billion. By 2028, advanced packaging is expected to account for 57.8% of the packaging industry, making it the main growth point of the global packaging market.