Knowledge Center

1. Causes and Impacts of MicrobubblesMicrobubbles (1–50 μm voids) formed by trapped gas during lamination degrade: Electrical performance: Increased dielectric loss (e.g., +0.005 tanδ at 10 GHz); Mechanical strength: 30–50% red...

Dog-bone Effect refers to the phenomenon where the plating thickness at the via entrance and exit is significantly greater than the middle region during high-aspect-ratio through-hole electroplating. This arises from limited electrolyte mass transfer and une...

Kirkendall voids, caused by differential atomic diffusion rates, critically degrade solder joint reliability. Key strategies to suppress their formation in SAC305 (Sn-3.0Ag-0.5Cu) include: 1. Alloy Composition Optimization Trace alloying elements: ...

1. Principles and Advantages of Aerosol Jet PrintingAerosol Jet Printing (AJP) deposits functional inks as micron-scale aerosols (1–5 μm) using sheath gas focusing, enabling: High resolution: 10 μm linewidth with ±2 μm placement ac...

1. TSV Fundamentals and 2.5D/3D ArchitecturesThrough-Silicon Via (TSV) enables vertical interconnects through silicon substrates, critical for chip stacking (3D) or interposer-based integration (2.5D). Key advantages include: Shorter interconnects: TSVs...

1. Definition and Objectives of Asymmetric Stack-upsAsymmetric layer stack-ups optimize signal integrity, thermal management, and mechanical strength by varying material thickness, copper types (e.g., RCF, LP), and dielectric constants (Dk). Key goals includ...

I. What is the Site The site comprises two elements: "现" (current time) and "场" (location). "现" emphasizes temporality, referring to the present moment. "场" emphasizes regionality, referring to a physical place. Combined: The site is a ...

1. Principles and Advantages of ALDAtomic Layer Deposition (ALD) employs self-limiting surface reactions to deposit conformal thin films (conformality >95%) through alternating precursor pulses (e.g., Cu(hfac)₂, H₂O). For high-aspect-ratio (AR>10:1) vias...

Reflow soldering temperature measurement boards are indispensable tools in the electronics manufacturing industry. By setting multiple temperature measurement points on the board and installing temperature sensors, they enable real-time monitoring of the tempe...

1. Definition and Influencing Factors of Sintering ShrinkageSintering shrinkage (ΔL/L₀) refers to the linear dimensional change of LTCC substrates during firing, critical for multilayer alignment and device performance. Key factors include: Mate...