Knowledge Center

1. Background & Challenges Precision conformal coating (moisture, dust, and corrosion protection) is critical in electronics manufacturing, especially for complex PCBs. Traditional methods face issues like overspray, fuzzy edges, and missed areas. Key optim...

BGA in the development of assembly processes or as an audit mechanism during production, and the inspection techniques used at different stages. The following table provides some recommendations on the applicability of inspection methods. Method Proc...

1. Sources of Dimensional Deviation Exposure tool accuracy: Optical distortion (±5μm) and alignment errors. Photoresist properties: Shrinkage (0.1–0.3%) and swelling during development. Development process: Temperature (&plusmn...

1. Causes of Interlayer Slip Interlayer slip in hybrid boards (e.g., FR-4/PTFE) arises from: CTE mismatch: PTFE (~100 ppm/°C) vs. FR-4 (~14 ppm/°C) thermal expansion； Resin flow disparity: PTFE’s low viscosity (~1000 cP) vs. epoxy&...

1. Etchant System Optimization High-selectivity etchant formulationUse H₂SO₄-H₂O₂ (3:1 ratio) with 0.5–1.0 g/L benzotriazole (BTA) to reduce side etching by 40–50% compared to FeCl₃ (side etch ratio

1. Mechanism of Bridging Defects Bridging occurs when solder fails to separate between adjacent joints, primarily due to: Excessive solder: Low drag angle prolongs solder contact time, inhibiting separation by surface tension; Uneven wetting: Impr...

1. Critical Impact Mechanisms Surface roughness (Ra) critically affects gold wire bonding performance through: Mechanical interlocking: High Ra (>0.5μm) reduces contact area, decreasing pull force by 20–30%; Oxidation risk: Micro-valleys ...

1. Root Causes of Wrinkling Key factors causing copper foil wrinkling in R2R processes: Tension imbalance: Local stress concentration due to tension gradients. CTE mismatch: Copper (17 ppm/°C) vs. PI (35 ppm/°C) expansion differences. ...

1. Core Challenges Ultra-thin cores (

An online automatic optical inspection (AOI) system is an indispensable tool in PCB manufacturing and electronic assembly, especially for detecting line gaps below 10μm. Below is a detailed explanation of how to achieve this using an online AOI system: ...