Knowledge Center

Abstract: Residual contaminants (flux, ionic compounds, etc.) on assembled PCBA can cause electrochemical migration, corrosion, and insulation failure. Per IPC-J-STD-001 and IPC-TM-650 standards, detection methods include ionic contamination testing, Surfa...

Abstract: The placement distance of decoupling capacitors critically impacts power integrity (PI) and signal integrity (SI). For high-frequency capacitors like 0.1μF, the optimal distance to IC power pins should be 1–3mm to minimize loop inductanc...

Abstract: The relative position between silkscreen and pads critically impacts PCBA manufacturability, inspectability, and reliability. Per IPC-7351/2221 standards, the core principle is "silkscreen must not contact pads, with sufficient clearance to preve...

Abstract: The solder fillet height of through-hole components critically impacts mechanical strength, electrical connectivity, and vibration resistance. Per IPC-A-610/J-STD-001 standards, the allowable range is 0.5–2.0mm, depending on component type,...

Abstract: Layer-to-layer registration accuracy in multilayer PCBs critically impacts signal integrity, via reliability, and product yield. According to IPC standards and process capabilities, the allowable registration tolerance for conventional multilayer...

The dimensional matching between solder mask openings (SMO) and pads is critical in PCB design, directly impacting soldering yield, electrical reliability, and long-term stability. The core principle is: SMO must be larger than pads to compensate for manuf...

Abstract: Visual inspection of PCBA is critical for soldering quality and reliability. Per IPC-A-610 standards, key mandatory items include missing components, misalignment, solder bridging, reversed polarity, and physical damage, directly impacting electr...

Abstract: Post-reflow PCB warpage critically impacts assembly yield, solder joint reliability, and product longevity. According to international standards (e.g., IPC) and application scenarios, the allowable warpage typically ranges from 0.3% to 1.5%, depe...

The position accuracy of solder mask openings (SMO) critically impacts PCB soldering yield, electrical performance, and reliability. The allowable deviation from pads depends on design specifications, manufacturing processes, and component types. The prima...

Abstract: Polyimide (PI) substrates in spacecraft applications are susceptible to atomic oxygen (AO) erosion, leading to surface roughening and electrical degradation. Low-temperature plasma annealing efficiently repairs AO-damaged layers through ion activ...