Knowledge Center

Abstract: Reference designator silkscreen is critical for PCBA assembly, rework, and traceability. Per IPC-7351B and IPC-2221, designs must ensure legibility, durability, and clearance, with detailed specifications below. 1. Font & Size Standards ...

Abstract: Curing quality of solder mask directly impacts PCB insulation, ENIG resistance, and mechanical strength. Per IPC-SM-840E, curing must balance the temperature-time-thickness triangle to achieve hardness ≥6H (pencil test) and adhesion ≥5B (ta...

Abstract: The matching between via size and trace width critically impacts signal integrity, manufacturability, and reliability. Per IPC-2221, core principles are "via current capacity ≥ trace current capacity" and "impedance continuity", with specific ...

Abstract: Reversed installation of polarized components (diodes, electrolytic capacitors) causes circuit failure, component burnout, or even explosions. Per IPC-A-610 and J-STD-001, detection requires a three-tier system: Optical Inspection (silkscree...

Abstract: Wave soldering parameters critically impact joint reliability, hole fill rate, and component safety. Core parameters (preheat temperature, solder temperature, conveyor speed, tilt angle) must be dynamically adjusted based on PCB thickness, compon...

Abstract: The choice between aqueous and solvent PCB cleaning impacts product reliability, environmental compliance, and cost. Key decision factors include contaminant type, component density, and environmental regulations. Aqueous cleaning targets polar r...

Abstract: Signal layer planning in 4-layer PCBs critically impacts signal integrity (SI), EMC, and crosstalk control. The core principle is "orthogonal routing between adjacent signal layers" (e.g., top layer horizontal, bottom layer vertical), combined wi...

Abstract: Fanout routing for low-speed IC pins aims to balance manufacturability, testability, and signal integrity. Per IPC-2221 and device manuals, core principles include power layer planning, shortest path, teardrop transitions, and test point allocati...

Abstract: Hole wall cleanliness directly determines the adhesion and reliability of electroless copper layers. Prior to deposition, methods including backlight testing, plasma etch testing, SEM/EDX analysis, and contact angle measurement ensure the absence...

I. Preface Due to its versatile properties, gold is widely used in many areas of the electronics industry. For example, it serves as an etch resist, a contact surface finish for circuit connections, a protective coating, a wire-bonded surface finish, a di...