Knowledge Center

1. Introduction: The Relationship Between High-Speed PCB Impedance Control and Stackup Design In high-speed PCBs (signal rate ≥5Gbps), impedance matching is a core prerequisite for ensuring signal integrity (SI). When the impedance of the signal tran...

1. Introduction: Core Significance of Heat Dissipation Path Planning for Electronic Devices In electronic devices, if the heat generated by components during operation cannot be dissipated in a timely manner, it will cause local temperature rise, leadin...

1. Introduction: Hazards and Control Significance of Via Stub Effects in High-Speed Backplanes In high-speed backplane design, vias are core structures for realizing signal interconnection between different layers. However, the "redundant hole segment" ...

1. Introduction: Core Significance of Impedance Continuity for RF Modules In radio frequency (RF) modules, coaxial connectors are key interface components for signal transmission between the module and external systems (such as antennas and test instrum...

1. Introduction: Structure and Application Value of Metal Substrates Metal substrates are special printed circuit boards composed of a metal base material (aluminum substrates are mainstream, with copper substrates, iron substrates, etc. as alternatives...

1. Introduction: Core Significance of Nozzle-Component Matching In Surface Mount Technology (SMT) production, the placement machine nozzle is a key executive component connecting the equipment and components. Its core function is to adsorb components th...

1. Introduction: Definition and Application Value of Rigid-Flex PCBs Rigid-Flex PCB is a composite printed circuit board that integrates rigid substrates and flexible substrates. It realizes circuit connection in complex spaces inside electronic devices...

1. Introduction: Restrictions on DecaBDE by RoHS 3 Directive and Impact on PCB Industry Since its implementation in 2006, the EU's "Directive on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment" (RoHS) ha...

1. Introduction: Definition and Application Background of High-Frequency Hybrid PCBs High-Frequency Hybrid PCB refers to a printed circuit board that integrates two or more high-frequency substrates with different characteristics (such as polytetrafluor...

1. Introduction: Definition and Function of Solder Mask Dam Solder Mask Dam, also known as solder resist dam or green oil bridge, is a key structure in the solder mask layer design of printed circuit boards (PCBs). It refers to the solder resist area be...